| PART |
Description |
Maker |
| RFP-1960-45-27 |
HPA Module
|
RFHIC
|
| RFP-0880-42-27 |
HPA Module
|
RFHIC
|
| RFP-0850-27-27PS |
HPA Module
|
RFHIC
|
| TGA2508-EPU |
Ku Band HPA
|
TriQuint Semiconductor
|
| TGA4501-EPU |
28-31 GHz Ka Band HPA
|
TriQuint Semiconductor
|
| TGA2509 |
Wideband 1 W HPA with AGC
|
TriQuint Semiconductor
|
| TGA2509 |
Wideband 1W HPA with AGC
|
TriQuint Semiconductor, Inc.
|
| TGA4505 |
4 Watt Ka Band HPA
|
TriQuint Semiconductor
|
| VZC-6965B5 |
CPI 2.25kW TWT C-Band HPA
|
Communications & Power Industries, Inc.
|
| LPS25HB |
MEMS pressure sensor: 260-1260 hPa absolute digital output barometer
|
STMicroelectronics
|
| EV42-160-22-SERIES EV44-100-22-SERIES EV44-160-22- |
TLC2555 Evaluation Module
TLC4545 Evaluation Module
TLC2551 Evaluation Module
CC1000DK-868/915 MHz Development Kit
CC2400DK Development Kit
TPA0172 Evaluation Module
Radiomodem 433 MHz
CC2400DBK Demonstration Board Kit
CC1000PP 433 MHz Plug and Play Module
Digital Data Capture and Analysis for High Speed, High Resolution A to D Converters
ADS1244 Evaluation Module
SN65HVD22EVM Evaluation Module
Peripheral IC 外围芯片
|
Infineon Technologies AG
NXP Semiconductors N.V.
Amphenol, Corp.
Xicon Passive Components
Electronic Theatre Controls, Inc.
|
| HYM72V8010GS-60 HYM72V8010GS-50 HYM72V8000GS-60 HY |
8M x 72 Bit ECC FPM DRAM Module buffered
8M x 72-Bit Dynamic RAM Module (ECC - Module)
8M x 72-Bit Dynamic RAM Module 8米72位动态随机存储器模块
8M x 72-Bit Dynamic RAM Module 8M X 72 FAST PAGE DRAM MODULE, 60 ns, DMA168
Connector; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes 8M X 72 FAST PAGE DRAM MODULE, 50 ns, DMA168
|
SIEMENS[Siemens Semiconductor Group]
Infineon
SIEMENS AG
|
